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Siemens Ramps Up Its Arsenal in Advanced Electronic Design – Why the New EDA Partnership is a Lift

Mike Ellow, CEO, Siemens EDA: “Alphawave Semi’s IP platforms are critical in AI, AUTONOMOUS VEHICLES, DATA NETWORKS and HYPERSCALING.” The point of the term “silicon IP” is to be able to work with pre-designed and pre-verified building blocks of digital or analog circuits, which are licensed for use in customized chip designs. This is not least valuable as chip designers with this type of building blocks can save time and reduce development costs, without sacrificing performance and quality. It is of course particularly beneficial since this type of advanced electronics is becoming increasingly common in fast-growing areas such as AI, autonomous vehicle development, data networks, hyperscaling and data storage. In short, these are areas where 3D IC design, chiplets and advanced manufacturing nodes are crucial.
Here, Siemens Digital Industries Software has taken an interesting initiative: Last week, the PLM division announced that it had signed an exclusive OEM agreement for its EDA business (Electronic Design Automation), with Alphawave Semis regarding their portfolio of interconnected high-speed silicon IP platforms, which are now being introduced into Siemens’ sales channel.
The agreement includes Alphawave Semis IP platforms for interconnect and memory protocols such as Ethernet, PCIe, CXL, HBM and UCIe (Die-to-Die) implementations. In addition to the IP sales channel agreement, both companies will collaborate to deliver comprehensive SPEC to Silicon Solutions. SPEC refers to the Standard Performance Evaluation Corporation, a non-profit organization that maintains and validates a standard set of benchmarks for high-performance computing and infrastructure.
Mike Ellow, CEO of Siemens EDA, claims in a comment that the agreement through Siemens EDA's global sales force will accelerate customers' access to the platforms' AI-powered, advanced silicon IP platforms.
"With Alphawave Semi's silicon IP, we are introducing industry-leading technology to our customers, enabling them to achieve unprecedented progress in various industries with dramatically shortened timescales," he says.
In principle, this involves solutions with complete silicon IP building blocks that customers can license and integrate into advanced System-on-Chip (SoC) designs, including implementations of 3D IC and chiplet-based technologies. The solutions are particularly critical for customers in large technological growth markets where 3D IC design, chiplets and advanced manufacturing nodes are crucial.
The now announced agreement is further confirmation of Siemens PLM division's systematic and long-term build-up on the EDA side. The company has implemented this investment in a particularly consistent manner, especially during Tony Hemmelgarn's time as CEO of the PLM division, with the acquisition of Mentor Graphics 2017 as a symbolic starting point. Of the 48 company and solution purchases made since then, acquisitions focused on digital manufacturing and EDA technology tools dominate.

To the different acquisitions can also be added various collaborations and partnerships around EDA and electronic solutions, including last week’s announced exclusive OEM agreement, where Alphawave Semis’ portfolio of interconnected high-speed silicon IP platforms is being brought into the Siemens sales channel. From the perspective of market development, the investment appears to be a sound step; EDA is today one of the most important elements in modern product realization where electronics, advanced chips and software increasingly control product content. This is clearly reflected in the revenue pattern of the Siemens PLM division, where the EDA part has grown to account for just over a third of total PLM revenues. But no matter how you look at it, the purchase of Mentor in 2017 stands out in the rearview mirror of history as a key investment, which has since been built upon step by step to today take a position as a tough challenger to the Synopsys/Ansys combination in electronics, advanced silicon IP, and related simulation solutions. Undeniably important pieces in view of strong traditional Siemens industry target segments such as automotive, aerospace & defense, heavy machinery, medical technology, electronics/hightech, and the like.

Reducing bottlenecks
About Alpawave, notably the company is an industry leader in high-speed connectivity IP with 112G and 224G SERDES chip designs across multiple nodes and fabs. In this, Alphawave delivers proven, multi-standard silicon IP platforms that enable faster data transfer and greater reliability with lower power for designs in 7nm, 6nm, 5nm and beyond.
“Siemens Digital Industries Software is an important and trusted partner for AI and hyperscaler developers, and our agreement simplifies and accelerates the process of developing SoCs for these, and other leading technologies. We are excited to bring Alphawave Semi’s IP to this market,” said Tony Pialis, CEO and President, Alphawave Semi. “Our technology plays a critical role in reducing interconnection bottlenecks and this collaboration significantly expands our customer reach, enabling more companies to deliver next-level computing.”

He added that Siemens will serve as a key partner associated with Alphawave Semi’s PHY, Controller and Subsystem platform IP optimized for advanced technology nodes – either individually or in conjunction with Siemens’ comprehensive range of EDA tools and services.

With this agreement, Siemens will be able to offer a range of solutions
PHY IP: Alphawave Semi’s industry-leading portfolio of multi-standard IP connectivity covering Ethernet, PCIe, CXL and Die-to-Die applications. These IPs support a wide range of data rates from 1Gbps to 224Gbps, used in over 30 different industry protocols/standards.
Controller IP: Siemens will offer MultiChannel/MultiRate Ethernet, PCIe, PCIe/CXL Combo, D2D streaming and HBM3E Memory Controllers, which together represent the industry’s leading comprehensive IP solution portfolio for interface controllers. These IPs cover the most widely used connectivity interfaces and offer low power, area and latency, while targeting applications in the data center, telecom, cloud computing, AI, NPU and 5G wireless spaces.
Subsystem platforms: Siemens’ offering will also include Alphawave Semi’s subsystem platforms, which combine industry-leading PHY IP and interface controller IP for an efficient end-to-end solution.

Meeting growing demand
Siemens and Alphawave Semi’s sales and solutions teams are joining forces to meet the growing demand for custom silicon and chiplet-based ASICs in the AI ​​era. ASICs (Application Specific Integrated Circuits) are computer chips that combine multiple circuits on a SoC to enable custom programming for specific tasks. Together, Siemens and Alphawave Semi will provide a comprehensive solution stack that extends from initial concepts to finished production parts. This collaboration aims to serve high-growth markets in AI, HPC and Networking, and offer flexible business models tailored to different customer categories.

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